بازدهی جریان پالسی در فرآیند پوشش‌دهی نانوذرات طلا از محلول دی‌سیانورات پتاسیم

مهندسی متالورژی و مواد

مقاله 3، دوره 26، شماره 1 - شماره پیاپی 11، اسفند 1393، صفحه 41-52   

نوع مقاله: علمی و پژوهشی

شناسه دیجیتال (DOI): 10.22067/ma.v26i1.23915

نویسندگان

پریسا وحدت خواه؛ سید خطیب الاسلام صدرنژاد^*

دانشگاه صنعتی شریف

چکیده

مقایسه‌ی اثر دو نوع زیرلایه و افزودنی نشان داد که هنگام پوشش‌دهی پالسی نانوذرات طلا، استفاده از اکسید ایندیم- قلع (به‌جای مس) و سیس‌تئین (به‌جای یُدید پتاسیم) سبب بهبود مُرفولوژی، افزایش تعداد نانوبلورها و بازدهی جریان الکتریکی و خواص فتوکاتالیزری می‌شود. مطالعات میکروسکُپ الکترونی روبشی گسیل میدانی نشان داد که با افزایش فرکانس پالسی از 50 به 8/142 هرتز و استفاده از یُدید پتاسیم، نانوخوشه‌های طلا روی سطح مس ظاهر می‌شوند و ضخامت پوشش و بازدهی جریان افزایش می‌یابند، ولی با کاهش چگالی جریان از 10 به 5/2 میلی‌آمپر بر سانتی‌متر مربع، ضخامت پوشش و بازدهی جریان کاهش می‌یابند.

کلیدواژه‌ها

نانوذرات طلا رسوب‌دهی الکتریکی پالسی؛ سیس‌تئین؛ یدید پتاسیم؛ مس، اکسید ایندیم قلع

مراجع

مراجع

1. Ballarin, B., Cassani, M. C., Maccato, C. and Gasparotto, A., "RF-sputtering preparation of gold-nanoparticle-modified ITO electrodes for electrocatalytic applications," Nanotechnology, Vol. 22, p. 275711, (2011).

2. Dai, X. and Compton, R. G., "Direct electrodeposition of gold nanoparticles onto indium tin oxide film coated glass: Application to the detection of arsenic(III)," Analytical sciences : the international journal of the Japan Society for Analytical Chemistry, Vol. 22, pp. 567-70, (2006).

3. Sarvestani, R. K. and Williams, J. D., "Frequency-Dependent Control of Grain Size in Electroplating Gold for Nanoscale Applications," Electrochemical and Solid-State Letters, Vol. 13, pp. D37-D39, (2010).

4. Olson, T. S., Atanassov, P. and Brevnov, D. A., "Electrodeposition of Gold Particles on Aluminum Substrates Containing Copper," The Journal of Physical Chemistry B, Vol. 109, pp. 1243-1250, (2004).

5. Oyama, M., "Wet Chemical Preparations and Electrochemical Applications of Metal Nanoparticle-Attached Indium Tin Oxide Electrodes," Review of Polarography, Vol. 53, pp. 3-18, (2007).

6. Mei Gao, D., Sun, Y. Y., Zhao, Q., Bo Hu, J. and Long Li, Q., "Determination of hemoglobin at a novel NH2/ITO ion implantation modified electrode," MicrochimicaActa, Vol. 160, pp. 241-246, (2008).

7. Tang, Y.-Y. and Chen, P.-Y., "Gold Nanoparticle-electrodeposited Electrodes Used for p-NitrophenolDetection in Acidic Media: Effect of Electrodeposition Parameters on Particle Density, Size Distribution, and Electrode Performance," Journal of the Chinese Chemical Society, Vol. 58, pp. 723-731, (2011).

8. Wang, L., Mao, W., Ni, D., Di, J., Wu, Y. and Tu, Y., "Direct electrodeposition of gold nanoparticles onto indium/tin oxide film coated glass and its application for electrochemical biosensor," Electrochemistry Communications, Vol. 10, pp. 673-676, (2008).

9. Sun, F., Cai, W., Li, Y., Duan, G., Nichols, W., Liang, C., Koshizaki, N., Fang, Q. and Boyd, I., "Laser morphological manipulation of gold nanoparticles periodically arranged on solid supports," Applied Physics B, Vol. 81, pp. 765-768, (2005).

10. Ustarroz, J., Gupta, U., Hubin, A., Bals, S. and Terryn, H., "Electrodeposition of Ag nanoparticles onto carbon coated TEM grids: A direct approach to study early stages of nucleation," Electrochemistry Communications, Vol. 12, pp. 1706-1709, (2010).

11. Choi, Y.-B., Kim, H., Han, G., Kim, H.-H. and Kim, S., "Voltammetric detection of trimethylamine using immobilized trimethylamine dehydrogenase on an electrodeposited goldnanoparticle electrode," Biotechnology and Bioprocess Engineering, Vol. 16, pp. 631-637, (2011).

12. QI-XIA, Y., "The effects of duty cycle and frequency on the crystal size of pulse-plated gold," Plating and surface finishing, Vol. 76, pp. 52-53, (1989).

13. سیاوش موخر، ر.، "آبکاری پالسی طلای خالص و آلیاژی"، پایان‌نامه کارشناسی ارشد، دانشگاه صنعتی شریف، (1389).

14. Dolati, A., Imanieh, I., Salehi, F. and Farahani, M., "The effect of cysteine on electrodeposition of gold nanoparticle," Materials Science and Engineering: B, Vol. 176, pp. 1307-1312, (2011).

15. Sakai, N., Fujiwara, Y., Arai, M., Yu, K., and Tatsuma, T., "Electrodeposition of gold nanoparticles on ITO: Control of morphology and plasmon resonance-based absorption and scattering," Journal of Electroanalytical Chemistry,Vol. 628, pp. 7-15, (2009).

16. El-Deab, M. S., Sotomura, T. and Ohsaka, T., "Oxygen reduction at electrochemically deposited crystallographically oriented Au (100)-like gold nanoparticles," Electrochemistry Communications,Vol. 7, pp. 29-34, (2005).

17. Shanthi, C., Barathan, S., Jaiswal, R. and Arunachalam, R. "Study of surface morphology in DC and pulse plating of silver alloy," Indian Journal of Engineering and Materials Sciences, Vol. 16, p. 128, (2009).

18. Li, Y. and Lasia, A., "Study of gold deposition on copper by electrochemical and microscopic techniques," Journal of applied electrochemistry, Vol. 27, pp. 643-650, (1997).

19. Kashtanov, P., Hippler, R., Smirnov, B. and Bhattacharyya, S., "Thermal fragmentation of nano-size clusters on surfaces," EPL (Europhysics Letters),Vol. 90, p. 16001, (2010).

20. Binns, C., "Materials produced by assembling gas-phase nanoclusters," Current Opinion in Solid State and Materials Science, Vol. 8, pp. 203-209, (2004).

21. Li, Y., Chrzanowski, W. and Lasia, A., "Nucleation and crystal growth in gold electrodeposition from acid solution Part I: Soft gold," Journal of applied electrochemistry, Vol. 26, pp. 843-852, (1996).

22. Paunovic, M., Schlesinger, M. and Snyder, D. D., "Fundamental Considerations," in Modern Electroplating, ed: John Wiley & Sons, Inc., pp. 1-32, (2010).

23. Bu, L., Wang, W. and Wang, H., "Effect of the substrate on the electrodeposition of Bi2Te3−ySey thin films," Materials Research Bulletin, Vol. 43, pp. 1808-1813, (2008).

24. Bouraiou, A., Aida, M., Tomasella, E. and Attaf, N., "ITO substrate resistivity effect on the properties of CuInSe2 deposited using two-electrode system," Journal of materials science, Vol. 44, pp. 1241-1244, (2009).

25. Abbaschian, R. and Reed-Hill, R. E., “Physical Metallurgy Principles”, 3rd ed., pp. 441, Tehran: Nopardazan Publisher, (2002).