A Measurement Setup for Radiated EMI of Un-buffered DRAM Modules

Journal Of Electrical Systems And Signals

مقاله 2، دوره 3، شماره 1، مرداد 2015، صفحه 15-22   

نوع مقاله: Researsh Articles

شناسه دیجیتال (DOI): 10.22067/ess.v3i1.42195

نویسندگان

Mojtaba Joodaki^* ؛ Amir Attar

Ferdowsi University of Mashhad

چکیده

As clock frequency and switching current of DRAM (dynamic random access memory) modules are ever increasing, electromagnetic interference (EMI) of such modules is gaining a very high degree of importance. Normally EMI measurements of memory modules are performed implementing complete motherboards or PCs. This makes it very difficult to only separate the radiated EMI of the memory module with a single EMI measurement. This is the first attempt to construct a shielded measurement setup for radiated EMI for DRAM PCBs. The measurement setup is fabricated and tested for un-buffered double data rate (DDR) modules and gives excellent results. This is very helpful in EMI and electromagnetic compatibility (EMC) investigation of memory modules. Although the measurement setup is just implemented for memory modules, the approach can be used for other types of PCBs too.

کلیدواژه‌ها

EMC/EMI measurement؛ DRAM PCBs radiation

مراجع

[1] V. P. Kodaly, Engineering Electromagnetic Compatibility. Piscataway, NJ: IEEE Press, 2001.

[2] C. R. Paul, Introduction to Electromagnetic Compatibility. Hoboken, NJ: John Wiley & Sons, 2006.

[3] N. Kumari, R. Shih, S. Escobar-Vargas, T. Cader, A. Govyadinov, S. Anthony, and C. Bash, “Air cooling limits of 3D stacked logic processor and memory dies,” 14th IEEE ITHERM Conference, pp. 92-97, 2014. 

[4] Y. Kim and Y. H. Song, “Analysis of thermal behavior for 3D integration of DRAM,” The 18th IEEE Int. Symposium on Consumer Electronics (ISCE 2014), pp. 1-2, 2014.

[5] K. Li, C. F. Lee, S. Y. Poh, R. T. Shin, and J. A. Kong, “Application of FDTD method to analysis of electromagnetic radiation from VLSI heatsink configurations," IEEE Trans. Electromagnetic Compatibility, vol. 35, no. 2, pp. 204-214, May 1993.

[6] C. Wang, J. L. Drewniak, J. L. Knighten, and D. Wang, “Grounding of heatpipe/heatspreader and heatsink structures for EM1 mitigation,” IEEE Int. Symposium on Electromagnetic Compatibility, pp. 916-920 (vol. 2), 2001.

[7] H. W. Ott, Electromagnetic Compatibility Engineering. Hoboken, NJ: John Wiley & Sons, 2009.

[8] “EN Standard 55022”, “Information Technology Equipment - Radio Disturbances Characteristics - Limits and Methods of Measurements,” European Committee for Electrotechnical Standardization (CELENEC), 2010.

[9] The International Technology Roadmap for Semiconductors: 2007, ITRS, 2007.

[10] M. Joodaki and A. Attar, “A radiated EMI measurement setup for un-buffered DRAM PCbs,” European Int. Symposium on Electromagnetic Compatibility (EMC Europe), pp. 756-759, 2014.

[11] “IEC 61967-2”, “Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method,” International Electrotechnical Commission, 2005.